Infineon und HTEC präsentieren humanoiden Roboterkopf mit Rundumblick​

München, 28. November 2025 – Die langjährige Zusammenarbeit zwischen Infineon Technologies und HTEC hat mit der Vorstellung des gemeinsam entwickelten 360° Awareness Humanoid Robotic Head einen neuen Meilenstein erreicht. Die Technologie ist das Ergebnis einer engen Kooperation in den Bereichen Embedded Engineering, Sensorfusion und KI-Integration.​

Der humanoide Roboterkopf stellt einen wichtigen Schritt in der Entwicklung wahrnehmungsfähigerer und reaktionsschnellerer Maschinen dar. Er ermöglicht es Robotern, mittels moderner Sensor- und Verarbeitungstechnologien die Welt durch räumliches Bewusstsein, Tiefenwahrnehmung und Geräuscherkennung zu verstehen.

Zu den zentralen Komponenten des Robotic Head gehören die Radarsensoren XENSIV 60 GHz für die präzise räumliche Wahrnehmung, die Time-of-Flight (ToF)-Sensoren REAL3 für die Tiefenwahrnehmung und die Digital-MEMS-Mikrofone XENSIV für die intelligente Audioerkennung von Infineon. Durch das Zusammenspiel dieser Komponenten kann der Roboter Anwesenheiten erkennen, Geräusche lokalisieren oder mithilfe integrierter Kameras visuelle Details analysieren.

HTEC spielte eine entscheidende Rolle bei der Einbettung dieser einzelnen Technologien in ein zusammenhängendes System. Das Unternehmen leitete die Konzeption, Integration und Software-Implementierung und nutzte dabei sein Know-how in den Bereichen Embedded Engineering und KI, um Radar-, ToF- und Audiodaten in einer zentralen Steuerungsarchitektur zu kombinieren. Das Ergebnis ist eine Lösung, die zeigt, wie solche Systeme leicht in Robotik- und Automatisierungsprojekte integriert werden können.

Die vollständige Pressemeldung in englischer Sprache:​

Infineon and HTEC Showcase Humanoid Robotic Head at Infineon’s OktoberTech™ Silicon Valley 2025 Show​

The prototype won the Partner Innovation Award for its innovative 360° multi-sensory awareness and human-interactive robotic capabilities.

The long-standing collaboration between Infineon Technologies AG and HTEC reached a new milestone this October at OktoberTech™ Silicon Valley 2025, where the two companies presented their jointly developed 360° Awareness Humanoid Robotic Head. The technology, which is a result of close partnership in embedded engineering, sensor fusion, and AI integration, captured the attention of attendees and was honored with the event’s Partner Innovation Award.

The Robotic Head represents a major step toward more perceptive and responsive machines. It demonstrates how cutting-edge sensing and processing technologies can enable robots to understand the world through multiple senses like spatial awareness, depth perception, and sound recognition to be able to respond in real time, much like a human would.

At the heart of the robotic head is Infineon’s flagship sensing portfolio, featuring XENSIV™ 60 GHz radar for precise spatial awareness, REAL3™ Time-of-Flight sensors for depth perception, and XENSIV™ high-performance digital MEMS microphones for intelligent audio recognition. Working together, these components allow the robot to detect presence, localize sound, turn toward its source, and use built-in cameras to analyze visual details. They enable it to create a seamless, multi-modal understanding of its environment.

“The Humanoid Awareness prototype demonstrates what can be achieved when cutting-edge technology, human creativity, and meaningful collaboration come together,” said Raul Hernandez Arthur, Head of SURF Enablement, Infineon Technologies. “By combining Infineon’s advanced XENSIV™ sensors and PSOC™ MCUs with HTEC’s expertise, this project peeks into the future of robotics—pushing the boundaries of what’s possible today. More than just an achievement, it’s an invitation to our customers to harness our technology and system expertise to turn their boldest ideas into transformative solutions, unlocking new potential to shape the industries of tomorrow.”

HTEC played a pivotal role in transforming these individual technologies into a cohesive system. The company led the design, integration, and software enablement, leveraging its embedded engineering and AI expertise to unify radar, ToF, and audio data into a single, responsive control architecture. The result is a platform that not only demonstrates advanced perception but also shows how such systems can be easily integrated into real-world robotics and automation projects.

“This project reflects what’s possible when hardware innovation meets advanced software intelligence,” added Dejan Pokrajac, Senior Client Partner at HTEC. “By combining Infineon’s sensing technologies with HTEC’s deep technical expertise in AI and embedded engineering, we created a system that reacts intelligently to its surroundings and can serve as a blueprint for the next generation of context-aware robotics.”

Beyond its technical sophistication, the humanoid head is designed for easy integration into customer projects, using standard embedded hardware and software platforms. This makes it a versatile reference design for companies developing robots and intelligent devices capable of safely and intuitively interacting with humans. 

Its applications span a wide range of domains from care robots that assist elderly patients, to autonomous delivery systems navigating crowded spaces, to smart home devices, and advanced security systems. Wherever contextual awareness and safe human-robot interaction are essential, the Infineon–HTEC humanoid head provides a foundation for innovation and practical implementation.

About HTEC

HTEC Group Inc. is a global AI-first provider of strategic, software and hardware embedded design and engineering services, specializing in Advanced Technologies, Financial Services, MedTech, Automotive, Telco, and Enterprise Software & Platforms. HTEC has a proven track record of helping Fortune 500 and hyper-growth companies solve complex engineering challenges, drive efficiency, reduce risks, and accelerate time to market. HTEC prides itself on attracting top talent and has strategically chosen the locations of its 20+ excellence centers to enable this.

About Infineon 

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 57,000 employees worldwide (end of September 2025) and generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).​

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